Soldering

Soldering is an important technique in the assembly of electronic products. It is the process of joining two metals by the use of a solder alloy, and it is one of the oldest known joining techniques.
Good soldering quality as a prerequisite for reliable joints can be achieved only through a soldering process in which a great number of variables have been optimised in a integrated system with respect to materials and to techniques.
The various mass-soldering processes have all their own particular characteristics. They differ in the way in which the solder flux and the solder alloy are applied to the parts to be joined and in the manner by which heat is supplied.
The list below describes the soldering methods, temperature and dwell time. This information should be considered as a recommendation. Depending on the specific application, i the most suitable method has to be selected.
The information and notes are based on the current state of the art. Soldering processes are subject to changes - certain adjustments will be applied also in this area.

Item to be soldered		Usual method
Centre conductor of coaxial cable		> soldering iron* > resistance heating* > laser*
Outer conductor of semi-rigid cable		> inductive* > soldering iron > resistance heating
Connector for printed circuit board through-hole version		> wave soldering > reflow soldering > soldering iron
Connector for printed circuit board surface-mount version		> reflow soldering > soldering iron
Connector with solder tab		> soldering iron > reflow soldering

* Our skilled staff with a specialised equipment can carry out complete RF lead-assemblies according to your specifications - at economic prices. Please contact our representative for further details about this service.

In addition to the soldering method, temperature and dwell time, parameters such as flux, surface, material and geometry of the parts to be soldered must be taken into account.